PART |
Description |
Maker |
B72510T0040M062 B72510T0060M062 B72510T0080L062 B7 |
Multilayer technology
|
EPCOS[EPCOS]
|
B72580T0600S172 B72580T0950S172 B72580T6750K072 B7 |
Multilayer technology MLV; Telecom Series 多层技术反转录电信系列
|
EPCOS AG
|
MLVS0603M07 MLVS0603M04 MLVS0603M06 MLVS-0603 MLVS |
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology
|
List of Unclassifed Manufacturers ETC[ETC]
|
PIC18F4680 PIC18F2585 PIC18F2585_07 PIC18F2680 PIC |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
PIC18F4580 PIC18F2580 PIC18F2480 18F258 PIC18F2580 |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology 28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology 10-Bit A/D and nanoWatt Technology (PIC18F2480 / 2580 / 4480 / 4580) Enhanced Flash Microcontrollers Microcontroller - Datasheet Reference
|
MICROCHIP[Microchip Technology] Microchip Technology Inc
|
UP025SL120J-B-BZ UP025SL150J-B-BZ UP025SL010D-B-BZ |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000015 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000001 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.00001 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0047 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.018 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0027 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0039 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0022 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0015 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0018 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0056 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.022 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0033 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.01 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0068 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
|
Taiyo Yuden Co., Ltd.
|
B72588G3140S200 B72548G3140S200 B72587E3200K000 |
Combination of a multilayer ceramic capacitor and a multilayer varistor, leaded
|
EPCOS AG
|
PIC18F4585-P PIC18F4585-I |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
PIC18F4680 PIC18F4585 PIC18LF4680-I301 PIC18LF4680 |
Enhanced Flash Microcontrollers with ECAN? Technology, 10-Bit A/D and nanoWatt Technology Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
ILBB-1812 ILBB1210 ILBB-1806 ILBB-1210 ILBB-1210-1 |
Surface Mount, Multilayer Ferrite Beads Surface Mount Multilayer Ferrite Beads Multilayer Ferrite Beads, Cases: 1210 Multilayer Ferrite Beads, Cases: 1806 Multilayer Ferrite Beads, Cases: 1812 Surface Mount/ Multilayer Ferrite Beads Inductors
|
Vishay Intertechnology,Inc. VISAY[Vishay Siliconix]
|
NMC0805Y5V105Z6.3TRP3KF NMC0603Y5V105Z6.3TRP3KF NM |
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 1 uF, SURFACE MOUNT, 0805 Multilayer Ceramic Chip Capacitors 多层陶瓷芯片电容 Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 1 uF, SURFACE MOUNT, 1206
|
NIC Components Corp. NIC Components, Corp.
|
SIGC03T60SNC |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip
|
Infineon Technologies AG
|
|